There’s a delicate balance in the constant evolution of today’s assembly line. Once dominated by hydraulics, manufacturing floors are incorporating a growing number of electromechanical solutions to supplement legacy hydraulic components, particularly in lower force, linear motion applications. Manufacturers that recognize this trend and harness the benefits of both hydraulic and electromechanical solutions position themselves to optimize future operations, regardless of market trend demands.

Nord Drivesystems is showcasing their modular drive solutions for high-volume packaging applications at Pack Expo 2024.

Wintriss Controls Group has added flexible and affordable purchase options for ShopFloorConnect OEE, Production Tracking, and Data Collection software, which allows users to quickly and easily leverage data from their machines. ShopFloorConnect is an on-premises software solution that provides timely, accurate, and unbiased data directly from the shop floor for making informed management decisions. Wintriss received a positive response when it debuted the new start-up purchase packages and options at Fabtech 2024. It will also be presenting the packages at Pack Expo 2024, Booth # LU-8431 McCormick Place, Chicago Illinois from November 3 – 6 this year.

In recent years, the power engineering manufacturing industry has been undergoing a significant modernization movement, driven by the rapid advancement of robotics, automation, and artificial intelligence. Amazon's recent announcement of its in Shreveport, Louisiana, serves as a prime example of this revolution in action. 

Global technology, software and engineering leader Emerson will exhibit its latest Floor to Cloud packaging solutions at Pack Expo Chicago, November 3-6, 2024. Advancing the boundless future of automation, Emerson factory automation solutions and its Floor to Cloud approach empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety. 

Bosch Rexroth will display product technologies and complete factory automation solutions for CPG manufacturing in Booth S-1548 at Pack Expo 2024, November 3-6, in Chicago, Illinois.

The S-17-85 Series of “C” Frame Pull Type Solenoids from Magnetic Sensor Systems (MSS) includes 18 different solenoids to select from based on the Voltage, Duty Cycle, Attractive Force (up to 91 oz) and Stroke length requirements of the user.  MSS Solenoid coils typically utilize 23 to 40 AWG (American Wire Gauge) windings with Class “F” insulation for better protection of the solenoid during longer duty cycles. Operating voltage range is from 3.0 VDC to 429 VDC, and from 5 to 40 Watts.

Today's demanding industrial applications require compact, robust connectors that can reliably transmit high currents and voltages. binder, a provider of circular connectors, now offers the perfect solution: special flange components act as plug-in partners for the PBC15 cable connector. This combination enables tailored solutions for a wide range of applications, such as in-drive technology.

In today's fast-paced production environments, picking and packing operations demand uninterrupted speed, reliability, accuracy and dexterity—all while maintaining critical food safety. Built with the highest quality standards to ensure unparalleled precision, FANUC cobots and robots deliver reliability and accuracy that minimizes error, reduces product waste and enhances overall quality control.

Explore cutting-edge robotic solutions designed to optimize your packaging operations, enhance efficiency, and boost productivity. From palletizing to picking and packing, Yaskawa (Booth #N-5736) collaborative and industrial robots deliver precision and flexibility for any job.