Emerson Exhibits Floor to Cloud Packaging Solutions at Pack Expo 2024
Global technology, software and engineering leader Emerson will exhibit its latest Floor to Cloud packaging solutions at Pack Expo Chicago, November 3-6, 2024. Advancing the boundless future of automation, Emerson factory automation solutions and its Floor to Cloud approach empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.
Visitors to North Building Level, Booth #5345, can view highlights from the extensive portfolio, which includes Aventics, Branson, Movicon, PACEdge and PACSystems solutions. Packaging automation experts will demonstrate how a Floor to Cloud approach unlocks trapped data and connects islands of automation, giving manufacturers the visibility and control to solve critical challenges and ambitious goals. Attendees will learn how to accelerate net zero progress, raise overall equipment effectiveness (OEE) asset by asset, and empower teams with data to drive continuous improvement across the factory floor.
Presentation and event highlights:
In addition to showcasing its innovative packaging automation solutions, Emerson will also sponsor two events, the annual Packaging & Processing Women’s Leadership Network (PPWLN) breakfast and the Amazing Packaging Race.
All women who are registered for Pack Expo Chicago are invited to the free PPWLN breakfast and program on Tuesday, November 4, at 7:30 a.m. in West Building, Room W-375. Following the breakfast, attendees will have the opportunity for a private show floor tour and participate in a Q&A with Lisa Propati, vice president and general manager of Weiler Labeling Systems, as well as other packaging executives.
As part of the Amazing Packaging Race, teams from U.S. colleges, trade schools and universities race to complete tasks and solve problems at booths across the Pack Expo show floor.