Bosch Rexroth Offers Automation Technology at SEMICON West 2022
Bosch Rexroth will showcase the company’s latest high-precision automation technology for every segment of the microelectronics supply chain, engineered to satisfy the extremely demanding requirements for semiconductor fabrication systems, in booth 1629 at SEMICON West 2022, July 12-14, in San Francisco, Calif
Technology demos will cover a full range of advanced automation, linear motion technology and transport technologies at SEMICON West 2022. With a comprehensive automation technology portfolio for every segment of the microelectronics supply chain — from wafer processing to final device packaging — Bosch Rexroth is equipped to help semiconductor manufacturers stay competitive in today's rapidly changing market.
Bosch Rexroth will present automation, linear technology, and transport solutions to help semiconductor manufacturers ensure excellent performance with automation solutions tailored for the needs of the semiconductor industry. Booth 1629 will feature key Rexroth systems for semiconductor applications, including:
ctrlX AUTOMATION Cube: This unique four-sided exhibit demonstrates the key capabilities of the ctrlX CORE automation controller. The exhibit uses a working ctrlX CORE controller to highlight the system’s connectivity through various automation and IT networks. Along with details about new ctrlX AUTOMATION apps from third-party suppliers, booth visitors will be able to see how the ctrlX CORE communicates with other demos in the booth.
Flexible Transport System demo: This working system demonstrates a magnetically propelled pallet transport system for high transfer speeds and precise pallet positioning that allows for independent and synchronized pallet movement, as well as integration into a traditional conveyor system.
PSK Gen 2 Precision Modules: This exhibit will highlight Bosch Rexroth’s generation 2 Precision Modules. Precise and ready-to-install, these linear motion systems combine high performance with compact dimensions and include favorable price/performance ratios and fast delivery. This latest generation features a sealed ball screw assembly on both sides and an upgraded lubrication concept, to more fully meet the demanding operational requirements of semiconductor production and electronics manufacturing.