Bonfiglioli is present at SPS Nuremberg from November 12-14. At Booth 450 in Hall 3A, Bonfiglioli showcases its comprehensive mechatronic proposal covering AMRs, material handling, logistics automation and packaging along with IIoT capabilities. Eyes also on electronics, with the solutions developed by Selcom.

Hottinger Brüel & Kjær (HBK) officially launched Advantage Insights empowered by nCode (Advantage Insights), their latest data analysis tool. Advantage Insights offers a powerful, intuitive solution designed to unlock the full potential of engineering data, by speeding up and simplifying the process of handling this data. Some of the key benefits include:

Global technology, software and engineering leader Emerson will exhibit its latest Floor to Cloud packaging solutions at Pack Expo Chicago, November 3-6, 2024. Advancing the boundless future of automation, Emerson factory automation solutions and its Floor to Cloud approach empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.