Siemens has announced the expansion of its ODB++ language intelligent, single data-structure for transferring PCB designs into fabrication, assembly and test with a unified electronics manufacturing solution of open data formats for the entire digital thread. With over 50,000 worldwide ODB++ users, rebranded as ODB++-Design, ODB++Process, ODB++Manufacturing and grouped under the ODB++ umbrella, Siemens‘ newest data exchange format, ODB++Process (previously known as OPM), helps enable the open exchange of process engineering information between disparate machines, software vendors, and stand-alone processes, helping accelerate new product introductions (NPIs) and first-time-right manufacturing. This is unique to the industry as no other standards body or solution provider offers a data exchange format for this capability.  

This free and proven data exchange solution helps users to easily transfer machine programs from one machine type to another, such as a target machine from a different vendor or a machine on a different platform. ODB++Process format provides the open exchange of process engineering information which then converts the data for immediate use on any production machine or workstation. 

“By using a single assembly format file output like ODB++Process, which standardizes machine package library’s with vShapes across the entire production line, Koh Young is able to minimize program variations between machines like inspection and mounters,” said JD Shin, chief sales office for Koh Young Technology. “The enhanced approach to programming reduces human error and variation and significantly reduces the NPI programming cycle time. What’s more, the single file assembly format output like ODB++Process is machine agnostic and easily enables moving production assembly data and process requirements between lines – and more importantly factories across the world.”

Thus, with ODB++Design supporting full product design data representation, and ODB++Manufacturing (previously known as OML) neutralizing machines‘ shop floor data, the ODB++Process now completes the open design-through-manufacturing digital thread for electronics. Each of these intelligent data exhange modules is designed to be neutral and open, supporting all SMT machine vendors (placement, inspection, test and soldering) and all EDA software providers. With a complete digital twin of the electronics manufacturing flow (product, process, and performance), customers can realize their latest Smart Factory or Industry 4.0 initiatives with confidence and efficiency.